Book Contents
Core Technology
Imbedded within chapters 1-9 is the prerequisite information that new
employees in a semiconductor company or beginning students in SMT educational
programs need to prepare them for reading chapters 10-20 (semiconductor
manufacturing process).
- Semiconductor industry overview
- Semiconductor materials
- Device technologies—IC families
- Silicon and wafer preparation
- Chemicals in the industry
- Contamination control
- Process metrology
- Process gas controls
- IC fabrication overview
Process Technology
Chapters 10-18 of the SMT book focus on the physical and chemical requirements
of the manufacturing processes, techniques, materials, and equipment needed
for manufacturing integrated circuit structures from silicon wafers. Chapters
19 and 20 cover the backend of the overall integrated circuit manufacturing
process.
- Oxidation
- Deposition
- Metallization
- Photoresist
- Exposure
- Develop
- Etch
- Ion implant
- Polish
- Test
- Assembly and packaging
Chapter Topics
Chapter 1: Introduction to the Semiconductor Industry
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Chapter 2: Characteristics of Semiconductor Materials
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Chapter 3: Device Technologies
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Chapter 4: Silicon and Wafer Preparation
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Chapter 5: Chemicals in Semiconductor Fabrication
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Chapter 6: Contamination Control in Wafer Fabs
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Chapter 7: Metrology and Defect Inspection
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Chapter 8: Gas Control in the Process Chamber
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Chapter 9: IC Fabrication Process Overview
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Process Technology
Chapters 10-18 of the SMT book focus on the physical and chemical requirements
of the manufacturing processes, techniques, materials, and equipment needed
for manufacturing integrated circuit structures from silicon wafers. Chapters
19 and 20 cover the backend of the overall integrated circuit manufacturing
process.
Chapter 10: Oxidation
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Chapter 11: Deposition
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Chapter 12: Metallization
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Chapter 13: Photolithography: Vapor Prime to Soft
Bake
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Chapter 14: Photolithography: Alignment and Exposure
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Chapter 15: Photolithography: Resist Development
and Advanced Lithography
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Chapter 16: Etch
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Chapter 17: Ion Implant
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Chapter 18: Chemical Mechanical Planarization
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Chapter 19: Wafer Test
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Chapter 20: Assembly and Packaging
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Appendices
Glossary
Index
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